1.27 mm Card Edge Connector

Note: Available with various mounting options, card guides, and polarization keys. Custom contact positions, card thickness compatibility, and specialized plating available.

1. High-Density 1.27mm Pitch for Maximum I/O Density
Features a compact 1.27mm (0.05 inch) pitch supporting 30 to 200 contact positions in dual row configuration - delivering exceptional I/O density for space-constrained PCBs. Perfect for high-performance computing, telecommunications, industrial controls, and test equipment requiring numerous connections in minimal board area.

2. Dual-Beam Bifurcated Contact Design for Reliable Connections
Features dual-beam, bifurcated contact design - providing two independent contact points for each connection. This ensures redundant contact integrity, increased vibration resistance, and extended mating cycle life compared to single-beam designs.

3. Standard 1.6mm Card Thickness with Robust Electrical Performance
Designed for standard 1.6mm ±0.2mm PCB card thickness - compatible with most PCB manufacturing standards. Rated at 1A to 3A per contact with 125V AC/DC, contact resistance ≤20 mΩ, insulation resistance ≥1000 MΩ, and dielectric withstand of 500V AC for 1 minute.

4. Premium Contact Plating with Multiple Mounting Styles
Gold flash to 0.8μm over nickel plating ensures excellent conductivity and corrosion resistance. Available in through-hole, SMT, or right-angle mounting styles - providing design flexibility for automated assembly, manual soldering, or edge-board applications.

• Contact Positions: Standard from 30 to 200 contacts (even numbers), custom counts available
• Card Thickness Compatibility: Standard 1.6mm, optional 1.2mm, 2.0mm, 2.4mm, or custom
• Contact Plating: Gold flash (0.1-0.3μm), selective gold (0.3-0.8μm), full gold (1μm+), or palladium nickel
• Mounting Styles: Vertical through-hole, right-angle (90°), surface mount, or straddle-mount
• Termination Types: Standard solder tail, press-fit, or SMT tails
• Mounting Hardware: Threaded inserts, mounting ears, board locks, or guide pins
• Card Guides: Integrated guides, snap-on guides, or metal clips for retention
• Polarization Options: Key slots, missing contacts, or custom polarization keys
• Housing Features: Pick-and-place pads, vacuum pickup areas, or high-temperature materials
• Color Coding: Black (standard), white, gray, or custom colors for identification

High-Density PCB Edge Connectivity for Modular Systems

• Industrial Computers & Single-Board Computers: Used for expansion modules, I/O cards, and mezzanine boards in industrial computing platforms where reliable, high-density connections are essential for system modularity and long-term reliability in harsh environments.
• Telecommunications & Networking Equipment: Deployed in switches, routers, and base stations for line cards, interface modules, and daughter boards requiring compact, high-signal-count connections with excellent signal integrity for high-speed data transmission.
• Embedded Systems & Edge Computing: Integrated into compact embedded controllers, IoT gateways, and edge computing devices where modular expansion capability must fit within limited PCB space while maintaining reliable connections for industrial applications.
• Test & Measurement Instruments: Used in modular test equipment, data acquisition systems, and instrumentation platforms where interchangeable function cards require precise, repeatable connections with minimal signal degradation.
• Medical Imaging & Diagnostic Equipment: Implemented in MRI systems, CT scanners, and diagnostic workstations for modular processing boards and interface cards requiring reliable, high-density connections in sensitive medical environments.
• Aerospace & Defense Electronics: Deployed in avionics systems, radar processing units, and military communications equipment where rugged, high-reliability connections must withstand vibration, shock, and extreme temperatures.

1.Michael Chen, Hardware Engineer, Industrial Computing Solutions
"These 1.27mm card edge connectors are our standard for CPU board expansion. The dual-beam contacts ensure reliable connection through thermal cycling, and the compact pitch allows 64 I/O signals in minimal board space."

2.Sarah Wang, Telecommunications Designer, Network Equipment
"Critical for our modular switch designs. The straddle-mount version provides excellent signal integrity for 10GbE line cards, and the integral card guides ensure proper alignment during field replacement."

3.Robert Zhang, Embedded Systems Architect, Industrial Automation
"Used in our edge computing platforms for modular I/O expansion. The 1.27mm pitch achieves the density we need while the robust through-hole mounting withstands industrial vibration environments."

• Payment method: Credit card or T/T (optional for large amounts). Western Union PayPal
• T/T payment generally supports 100% advance payment.
• Lead time: Normally in 5-10 working days after payment received.
• Sample policy: Samples are always available for each model for standard products.
• Samples can be ready in 3-5 working days once payment received.
• Shipping port: Shenzhen, China.

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