1.27 mm Pitch Box Header Connector

Note: Available with various mounting options including solder hold-downs and mounting pegs. Custom pin counts and plating options available.

1. Compact 1.27mm Pitch for High-Density PCB Designs
Features a space-saving 1.27mm (0.050 inch) pitch supporting single row (2 to 50 pins) and dual row (4 to 100 pins) configurations - maximizing connection density on space-constrained PCBs. Perfect for telecommunications equipment, data storage systems, industrial controls, and compact electronic devices.

2. Versatile Mounting Options for Any Assembly Process
Available in through-hole, surface mount (SMT), and right-angle mounting styles to suit your PCB layout and manufacturing requirements. Compatible with manual soldering, wave soldering, and reflow processes - providing design flexibility for diverse applications.

3. Reliable Electrical Performance for Signal Transmission
Rated at 1A to 1.5A per contact with 100V to 125V AC/DC - ideally suited for signal transmission and low-power applications. Phosphor bronze contacts with gold or tin plating over nickel ensure low contact resistance and excellent corrosion resistance.

4. High-Temperature Housing with UL94V-0 Flame Rating
Housing molded from PBT or PA6T with UL94V-0 flame rating provides excellent thermal stability and fire safety. Available in tube, tape and reel, or tray packaging to support manual assembly or high-speed automated production lines.

• Pin Configurations: Single row (2-50 pins) or dual row (4-100 pins)
• Mounting Styles: Vertical (straight), right-angle (90°), or SMT
• Contact Plating: Gold flash (0.1μm), selective gold (0.3-0.8μm), or tin
• Housing Features: Polarization posts, mounting pegs, solder tabs
• Color Coding: Black (standard), white, gray, or custom colors
• Packaging: Tube, tape and reel (SMT), or bulk
• Special Features: Pick-and-place compatible, high-temperature materials

High-Density Shrouded Connections for Space-Constrained Systems

• Industrial Control & Automation: Used in compact PLC modules, sensor interfaces, and I/O cards where high pin density is required in limited board space.
• Medical Devices: Deployed in portable patient monitors, diagnostic equipment, and handheld medical instruments requiring reliable, compact interconnections.
• Consumer Electronics: Used in smartphones, tablets, wearable devices, and portable audio equipment where space optimization is critical.
• Telecommunications Equipment: Integrated into routers, switches, and network modules for high-density internal connections.
• Test & Measurement: Used in benchtop instruments and portable test equipment requiring dense signal routing.
• Embedded Systems: Deployed in single-board computers, industrial controllers, and IoT gateways requiring compact board-to-board connections.
• Automotive Electronics: Used in infotainment systems, advanced driver assistance systems (ADAS), and body control modules where space is limited.
• Aerospace & Defense: Integrated into avionics, communication systems, and portable military equipment requiring high reliability in compact form factors.

1)Experienced in interface connectors and cable assemblies, we can offer a wide range of standard production capabilities such as stamping, injection molding, prototype, connectors and cable assemblies, customized connectors and cable assemblies, and custom retail packaging.

2)Advancing interconnect technology. Our team can offer a world-class interconnect experience from initial consultation to final delivery to meet solutions for our customer's interconnect challenge, our personalized design and engineering package include CAD drawings, 3D models, prototypes and testing samples.

3)Building connections worldwide. We can provide a wide range of interconnect solutions in order to meet the needs of customers in many different types of markets,some of the most popular markets such as:high-end consumer electronics, data storage, set-top box, medical, home security,industrial, audio/video, desktop and mobile computer units.

4)High quality products and competitive pricing.

5)Exceeding expectations. our Quality Policy is Quality First, Customer First.

1.Priya, medical device designer in Bangalore
"Portable patient monitors need every millimeter of board space. These 1.27mm dual row headers with 80 pins fit our compact design perfectly. The gold-plated contacts maintain signal integrity for critical data. Reliable parts."

2.Dave, telecom engineer in California
"Router line cards use these 1.27mm box headers for high-density interconnects. The 100-pin version gives us plenty of I/O. Right-angle version works for our mezzanine card design. Consistent quality across batches."

3.Carlos, embedded systems engineer in Texas
"Using these on custom IoT gateway boards. The 1.27mm pitch lets us pack more features in small form factor. The vertical through-hole version is easy to hand-solder for prototypes. Good value for the money."

4.Tom, test equipment designer in the UK
"Portable oscilloscopes need dense internal connections. These 1.27mm headers with selective gold maintain signal integrity. The 2-row 60-pin version fits our board layout. Would recommend."

5.Yuki, robotics engineer in Tokyo
"Compact robot controllers need high-density interconnects. These 1.27mm dual row headers provide 64 signals in small area. The shrouded design protects pins during board swapping. Good value."

• Payment method: Credit card or T/T (optional for large amounts). Western Union PayPal
• T/T payment generally supports 100% advance payment.
• Lead time: Normally in 5-10 working days after payment received.
• Sample policy: Samples are always available for each model for standard products.
• Samples can be ready in 3-5 working days once payment received.
• Shipping port: Shenzhen, China.

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